公司提供蕊(rui)片(pian)封裝高精度(du)冷水機組(zu),蕊(rui)片(pian)封裝制(zhi)冷,蕊(rui)片(pian)制(zhi)冷方案服務

蕊片制冷(leng)方案服務背(bei)景技術:

2. 半(ban)導體(ti)激光器具有體(ti)積小、重量輕、效率高等優點(dian)，廣泛(fan)應(ying)用(yong)于光通信等領域。

3.目前，半導體(ti)激光(guang)器(qi)可以以制冷(leng)的形式封裝(zhuang)(zhuang)，通常包括一個(ge)金屬底座、一個(ge)安(an)裝(zhuang)(zhuang)在金屬底座上的熱電冷(leng)卻器(qi)和一個(ge)安(an)裝(zhuang)(zhuang)在熱電冷(leng)卻器(qi)上的鎢(wu)銅(tong)塊(kuai)(kuai)。為了安(an)裝(zhuang)(zhuang)背光(guang)監(jian)(jian)測(ce)探(tan)測(ce)器(qi)芯片，對產品的背光(guang)進行監(jian)(jian)測(ce)，通常將(jiang)鎢(wu)銅(tong)塊(kuai)(kuai)設(she)置為一體(ti)化的l型，背光(guang)監(jian)(jian)測(ce)探(tan)測(ce)器(qi)芯片設(she)置在鎢(wu)銅(tong)塊(kuai)(kuai)的水平部(bu)分，激光(guang)芯片設(she)置在鎢(wu)銅(tong)塊(kuai)(kuai)的縱(zong)向部(bu)分。

水(shui)冷(leng)(leng)(leng)(leng)式(shi)制(zhi)冷(leng)(leng)(leng)(leng)效果(guo)較好，但需要(yao)冷(leng)(leng)(leng)(leng)卻水(shui)，風(feng)冷(leng)(leng)(leng)(leng)式(shi)靈活方便，無需冷(leng)(leng)(leng)(leng)卻水(shui)，適合缺水(shui)地區或需移動場合使用。冷(leng)(leng)(leng)(leng)凍(dong)機的(de)工作介質即為(wei)制(zhi)冷(leng)(leng)(leng)(leng)系統中(zhong)(zhong)(zhong)擔負(fu)著傳遞熱量任務的(de)制(zhi)冷(leng)(leng)(leng)(leng)劑(ji)(ji)，常(chang)用的(de)制(zhi)冷(leng)(leng)(leng)(leng)劑(ji)(ji)有：氟(fu)(fu)里(li)昂、氨、溴(xiu)化(hua)鋰、氯甲烷等，其中(zhong)(zhong)(zhong)氟(fu)(fu)里(li)昂按其氣化(hua)溫(wen)(wen)度(du)及(ji)化(hua)學分(fen)子式(shi)的(de)不(bu)同有氟(fu)(fu)11(R-11)、氟(fu)(fu)12(R-12)、氟(fu)(fu)13(R-13)、氟(fu)(fu)21(R-21)、氟(fu)(fu)22(R-22)、氟(fu)(fu)113(R-113)、氟(fu)(fu)114(R-114)、氟(fu)(fu)142(R-142)等多種。上述制(zhi)冷(leng)(leng)(leng)(leng)劑(ji)(ji)可(ke)分(fen)別用于(yu)(yu)低壓(ya)(ya)(冷(leng)(leng)(leng)(leng)凝(ning)壓(ya)(ya)力小于(yu)(yu)0.3-0.3MPa)高(gao)溫(wen)(wen)(蒸(zheng)發溫(wen)(wen)度(du)大于(yu)(yu)0℃)、中(zhong)(zhong)(zhong)壓(ya)(ya)(冷(leng)(leng)(leng)(leng)凝(ning)壓(ya)(ya)力1-2MPa)中(zhong)(zhong)(zhong)溫(wen)(wen)(蒸(zheng)發溫(wen)(wen)度(du)0—-50℃)及(ji)高(gao)壓(ya)(ya)(冷(leng)(leng)(leng)(leng)凝(ning)壓(ya)(ya)力大于(yu)(yu)2MPa)低溫(wen)(wen)(蒸(zheng)發溫(wen)(wen)度(du)小于(yu)(yu)-50℃)的(de)制(zhi)冷(leng)(leng)(leng)(leng)系統里(li)。

蕊片封裝制冷技術實(shi)現要素:

針對(dui)芯(xin)(xin)(xin)片(pian)(pian)散熱，本發(fa)明專(zhuan)利技術(shu)公開了一(yi)種芯(xin)(xin)(xin)片(pian)(pian)**制冷(leng)裝置，可自(zi)動實現對(dui)芯(xin)(xin)(xin)片(pian)(pian)的多級冷(leng)卻，有效解(jie)決結溫過高的問(wen)題(ti)，有效解(jie)決熱電(dian)芯(xin)(xin)(xin)片(pian)(pian)熱端溫度(du)過高的問(wen)題(ti)，有效降低整體功耗。

一(yi)種芯(xin)片(pian)**制(zhi)冷裝置，包(bao)括芯(xin)片(pian)封裝結構(gou)和散(san)熱單元。

所(suo)述(shu)芯(xin)片(pian)封裝結構包括芯(xin)片(pian)、模(mo)具、引(yin)線、芯(xin)片(pian)粘(zhan)(zhan)合(he)劑、模(mo)具和襯底。所(suo)述(shu)芯(xin)片(pian)位于(yu)基板(ban)上方，并(bing)(bing)與芯(xin)片(pian)粘(zhan)(zhan)合(he)劑連接;塑(su)料模(mo)具位于(yu)芯(xin)片(pian)上方;引(yin)線從芯(xin)片(pian)的兩端引(yin)出并(bing)(bing)連接到基板(ban)中(zhong)。

所(suo)(suo)述(shu)(shu)散(san)熱(re)(re)(re)(re)單(dan)(dan)元包括微通道(dao)散(san)熱(re)(re)(re)(re)器和熱(re)(re)(re)(re)電(dian)(dian)(dian)翅片(pian);所(suo)(suo)述(shu)(shu)熱(re)(re)(re)(re)電(dian)(dian)(dian)片(pian)主(zhu)要由單(dan)(dan)熱(re)(re)(re)(re)電(dian)(dian)(dian)對陣(zhen)列形(xing)成，所(suo)(suo)述(shu)(shu)單(dan)(dan)熱(re)(re)(re)(re)電(dian)(dian)(dian)對包括p、n型熱(re)(re)(re)(re)電(dian)(dian)(dian)臂、銅電(dian)(dian)(dian)*、絕緣襯底(di)、雙金(jin)屬片(pian)和觸點(dian);所(suo)(suo)述(shu)(shu)微通道(dao)散(san)熱(re)(re)(re)(re)器位于(yu)(yu)所(suo)(suo)述(shu)(shu)熱(re)(re)(re)(re)電(dian)(dian)(dian)片(pian)的熱(re)(re)(re)(re)端，所(suo)(suo)述(shu)(shu)蓋板(ban)、填充(chong)金(jin)屬片(pian)和底(di)板(ban)依(yi)次上下(xia)排列，所(suo)(suo)述(shu)(shu)底(di)板(ban)上開有多(duo)個平行(xing)散(san)熱(re)(re)(re)(re)微通道(dao);微通道(dao)散(san)熱(re)(re)(re)(re)器位于(yu)(yu)熱(re)(re)(re)(re)電(dian)(dian)(dian)片(pian)的熱(re)(re)(re)(re)端絕緣襯底(di)上方(fang)（備注：文(wen)章部分內容，轉(zhuan)載來源互聯(lian)網）